1 pm MOSFET VLSI Technology: Part lV— Hot-Electron Design Constraints
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Tak H. Ning | Peter W. Cook | Stanley E. Schuster | Robert H. Dennard | R. Dennard | T. Ning | H. Yu | H. N. Yu | S. Schuster | P. Cook
[1] B.L. Crowder,et al. 1 /spl mu/m MOSFET VLSI technology. V. A single-level polysilicon technology using electron-beam lithography , 1979, IEEE Journal of Solid-State Circuits.
[2] R. R. Troutman. Silicon surface emission of hot electrons , 1978 .
[3] Tak H. Ning,et al. High‐field capture of electrons by Coulomb‐attractive centers in silicon dioxide , 1976 .
[4] E. M. Buturla,et al. Steady-state analysis of field effect transistors via the finite element method , 1975 .
[5] T.H. Ning. Hot-electron emission currents in N-channel IGFET's , 1977, 1977 International Electron Devices Meeting.
[6] Tak H. Ning,et al. Electron trapping at positively charged centers in SiO2 , 1975 .
[7] Peter E. Cottrell,et al. Hot-electron emission in N-channel IGFET's , 1979 .
[8] Sura Adil Abbas,et al. N-channel IGFET design limitations due to hot electron trapping , 1975 .
[9] Donald R. Young,et al. Electron trapping in electron‐beam irradiated SiO2 , 1978 .
[10] J. H. Thomas. Transient photodepopulation measurements of electron trap distributions in thin SiO2 films on silicon , 1973 .
[11] Donald R. Young. Electron current injected into SiO2 from p‐type Si depletion regions , 1976 .
[12] B.L. Crowder,et al. 1 µm MOSFET VLSI technology: Part V—A single-level polysilicon technology using electron-beam lithography , 1979, IEEE Transactions on Electron Devices.
[13] J. H. Thomas,et al. Electron trapping levels in silicon dioxide thermally grown on silicon , 1972 .
[14] Tak H. Ning,et al. Emission probability of hot electrons from silicon into silicon dioxide , 1977 .
[15] S. A. Abbas,et al. Hot‐carrier instability in IGFET’s , 1975 .
[16] Tak H. Ning,et al. Threshold instability in IGFET’s due to emission of leakage electrons from silicon substrate into silicon dioxide , 1976 .
[17] P.W. Cook,et al. 1 /spl mu/m MOSFET VLSI technology. III. Logic circuit design methodology and applications , 1979, IEEE Journal of Solid-State Circuits.
[18] R.H. Dennard,et al. 1 /spl mu/m MOSFET VLSI technology. II. Device designs and characteristics for high-performance logic applications , 1979, IEEE Journal of Solid-State Circuits.
[19] H. Hara,et al. A New Instability in MOS Transistor Caused by Hot Electron and Hole Injection from Drain Avalanche Plasma into Gate Oxide , 1970 .