A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures

Chip-Package Interaction (CPI) is a significant concern for modern electronic devices and this concern is magnified for 3D Stacked IC. Hard bumps, soft dielectrics, thin die and complex geometries of the stacked die require an ability to model and evaluate the interactions and risks. In packaged IC, dissimilar materials along with the thermal history during the assembly process results in significant residual stresses. These stresses can impact process yields, reliability and die electrical performance. Examples of these effects are ball cracking, ILD/ELK cracking or delamination and shifts in the behavior of sensitive devices such as transistors in analog circuits. Traditionally modeling and evaluation of these risks have been handled by different groups/companies (foundry, OSAT, Fabless Device Mfg) and have been hindered by the difficulty of using different tools and more importantly collaborating without revealing proprietary models and process information/recipes. In this paper we present a modeling f...