论文信息 - Effect of Rapid Solidification on Structure and Properties of Some Lead-Free Solder Alloys

Effect of Rapid Solidification on Structure and Properties of Some Lead-Free Solder Alloys

Four of the binary lead-free solder alloys of compositions Sn-0.5Cu, Sn-3.5Ag, Sn-5Sb and Sn-9Zn, were rapidly solidified by melt-spinning technique as a technique for producing new alloy compositions. The results show that rapid solidification causes formation of some intermetallic compounds such as Ag3Sn and Cu6Sn5 in the two alloys Sn-3.5Ag and Sn-0.5Cu, which cannot be formed at the equilibrium phase diagram at these compositions; contraction in the volume of the unit cell of the tetragonal Sn; reduction of the melting points due to the decrease in the crystalline size of Sn matrix; and formation of some vacancies in the resulting alloys, which cause reduction of the measured density than that calculated by mixture rule and increase the electrical resistivity.

Mustafa Kamal | E. Gouda | M. Kamal | El-Said Gouda

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