Waste in the Wireless World: The Challenge of Cell Phones

[1]  Tomasz Imielinski,et al.  Mobile Computing , 1996 .

[2]  Alden M. Hayashi,et al.  Taking on the Energizer Bunny , 1998 .

[3]  B. Trumble,et al.  Technical progress on printed wired assembly using Nortel's no-lead solder assemble process , 1998, Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment. ISEE - 1998 (Cat. No.98CH36145).

[4]  Tim Jackson,et al.  A Dynamic Life‐Cycle Energy Model of Mobile Phone Take‐back and Recycling , 1999 .

[5]  A. Middendorf,et al.  Environmental performance of mobile products , 1999, Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357).

[6]  J. Chiodo,et al.  Active disassembly using shape memory polymers for the mobile phone industry , 1999, Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357).

[7]  M. M. Fisher,et al.  Minnesota's multi-stakeholder approach to managing electronic products at end-of-life , 2000, Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment (Cat. No.00CH37082).

[8]  Casper Boks,et al.  Combining economical and environmental considerations in cellular phone design , 2000, Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment (Cat. No.00CH37082).

[9]  C. F. Murphy,et al.  Survey of alternatives to tin-lead solder and brominated flame retardants , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[10]  T. Suga,et al.  Lead-free soldering-toxicity, energy and resource consumption , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[11]  T. Brady,et al.  Product ecology at Intel , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[12]  L. J. Turbini,et al.  Examining the environmental impact of lead-free soldering alternatives , 2001 .

[13]  G. A. Henshall,et al.  The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[14]  Kellyn S Betts,et al.  Rapidly rising PBDE levels in North America. , 2002, Environmental science & technology.

[15]  Thomas Lindhqvist,et al.  EPR Programme Implementation: Institutional and Structural Factors , 2003 .