Design of Data Acquisition System Based on LabVIEW

Based on LabVIEW, this paper presents a design scheme of data acquisition, which it proposes using computer and ordinary data collection card as the main hardware and LabVIEW as software development platform, thus constructs the virtual instrument system for signal acquisition. The system can realize synchronous data acquisition of single channel or multi-channel signal, as well as real-time display and preservation. The practice shows that this scheme can not only effectively play performance of ordinary data acquisition card, but also reduce greatly program development time and beautify interface through LabVIEW which has powerfully visual human-machine interface editor and graphical programming function.

[1]  Jianhua Zhang,et al.  Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film , 2010 .

[2]  U. Geissler,et al.  Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts , 2011 .

[3]  C.F.M. Loureiro,et al.  A fundamental data acquisition saving block , 2005, IEEE Nuclear Science Symposium Conference Record, 2005.

[4]  Li Jun-yuan.  Development of Data Collection and Process System for Complex Surfaces Pressure with LabVIEW , 2009 .

[5]  Bo-In Noh,et al.  Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding , 2008 .

[6]  Junhui Li,et al.  Microstructural characteristics of Au/Al bonded interfaces , 2007 .

[7]  Liu Dongdong.  Design of the Data Acquisition and Signal Processing System Based on LabVIEW , 2012 .

[8]  Luhua Deng,et al.  Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding , 2011, IEEE Electron Device Letters.

[9]  K. Paik,et al.  Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability , 2003 .

[10]  Narasimalu Srikanth,et al.  Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds , 2004 .

[11]  Li Wenjun.  The System of Data Acquisition and Signal Analysis Based on LabVIEW , 2005 .

[12]  Junhui Li,et al.  Interface mechanism of ultrasonic flip chip bonding , 2007 .

[13]  Y. H. Tian,et al.  Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound , 2011, Microelectron. Reliab..

[14]  Bu Xiong-zhu.  Development of Data Acquisition and Wireless Communication System Based on LabVIEW , 2006 .

[15]  Emmanuel M. Drakakis,et al.  A Real-Time Multi-Channel Monitoring System for Stem Cell Culture Process , 2008, IEEE Transactions on Biomedical Circuits and Systems.

[16]  Wang Xuegang,et al.  Design and implementation of 1 GHz high speed data acquisition system , 2012 .

[17]  Zhao Peng.  Data Acquisition and Signal Analysis Based on LabVIEW , 2007 .

[18]  Chunqing Wang,et al.  Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy , 2008 .

[19]  Vadim V. Silberschmidt,et al.  Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds , 2011 .