Experimental assessment of vapour chamber heat spreader implementation in avionic cooling
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[1] Shung-Wen Kang,et al. Experimental studies of thermal resistance in a vapor chamber heat spreader , 2013 .
[2] J. R. Arias,et al. Experimental and theoretical study of a vapour chamber based heat spreader for avionics applications , 2012 .
[3] Issam Mudawar,et al. Assessment of high-heat-flux thermal management schemes , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
[4] Ray Wilkinson. Aircraft structures and systems , 1996 .
[5] Landon A. Strattan. Capabilities and Limitations of Air Cooled Avionic Packages , 1983 .
[6] Paisarn Naphon,et al. Study on the vapor chamber with refrigerant R-141b as working fluid for HDD cooling , 2012 .
[7] Jens Weyant,et al. Enhancing thermal performance in embedded computing for ruggedized military and avionics applications , 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
[8] Maciej Jaworski,et al. Thermal performance of heat spreader for electronics cooling with incorporated phase change material , 2012 .
[9] Michael Pecht,et al. An investigation of ‘cannot duplicate’ failures , 1998 .
[10] Ian Moir,et al. Aircraft Systems: Mechanical, Electrical, and Avionics Subsystems Integration , 2008 .
[11] Ted J. Kramer,et al. Thermal Design of Standard Avionic Enclosures , 1982 .
[12] Peter Söderholm. A system view of the No Fault Found (NFF) phenomenon , 2007, Reliab. Eng. Syst. Saf..
[13] B. Steadman,et al. Reducing No Fault Found using statistical processing and an expert system , 2002, Proceedings, IEEE AUTOTESTCON.
[14] Sai Cheong Fok,et al. Experimental studies on the use of a phase change material for cooling mobile phones , 2010 .
[15] B. A. Jubran,et al. Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules , 1996 .