Vibration and shock reliability of MEMS: modeling and experimental validation

A methodology to predict shock and vibration levels that could lead to the failure of MEMS devices is reported as a function of vibration frequency and shock pulse duration. A combined experimental–analytical approach is developed, maintaining the simplicity and insightfulness of analytical methods without compromising on the accuracy characteristic of experimental methods. The minimum frequency-dependent acceleration that will lead to surfaces coming into contact, for vibration or shock inputs, is determined based on measured mode shapes, damping, resonant frequencies, and an analysis of failure modes, thus defining a safe operating region, without requiring shock or vibration testing. This critical acceleration for failure is a strong function of the drive voltage, and the safe operating region is predicted for transport (unbiased) and operation (biased condition). The model was experimentally validated for over-damped and under-damped modes of a comb-drive-driven silicon-on-insulator-based tunable grating. In-plane and out-of-plane vibration (up to 65 g) and shock (up to 6000 g) tests were performed for biased and unbiased conditions, and very good agreement was found between predicted and observed critical accelerations.

[1]  Robert Puers,et al.  A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches , 2004 .

[2]  M. Younis,et al.  Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock , 2007, Journal of Microelectromechanical Systems.

[3]  H. Seppa,et al.  Nonlinear limits for single-crystal silicon microresonators , 2004, Journal of Microelectromechanical Systems.

[4]  M. R. Douglass,et al.  Lifetime estimates and unique failure mechanisms of the Digital Micromirror Device (DMD) , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

[5]  G. X Li,et al.  Drop test and analysis on micro-machined structures , 2000 .

[6]  V. T. Srikar,et al.  The reliability of microelectromechanical systems (MEMS) in shock environments , 2002 .

[7]  William N. Sharpe,et al.  Fracture strength of polysilicon at stress concentrations , 2003 .

[8]  Larry Levit,et al.  Electrical breakdown and ESD phenomena for devices with nanometer-to-micron gaps , 2003, SPIE MOEMS-MEMS.

[9]  S. Senturia Microsystem Design , 2000 .

[10]  Jeremy A. Walraven,et al.  MEMS reliability in shock environments , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[11]  Herbert R. Shea,et al.  ESD testing and combdrive snap-in in a MEMS tunable grating under shock and vibration , 2011, MOEMS-MEMS.

[12]  S.K. De,et al.  Full-Lagrangian schemes for dynamic analysis of electrostatic MEMS , 2004, Journal of Microelectromechanical Systems.

[13]  A. Gasparyan,et al.  Effects of electrical leakage currents on MEMS reliability and performance , 2004, IEEE Transactions on Device and Materials Reliability.

[14]  Michael Curt Elwenspoek,et al.  Comb-drive actuators for large displacements , 1996 .

[15]  Toshiyuki Tsuchiya,et al.  Reliability of MEMS , 2007 .

[16]  Zhenchuan Yang,et al.  An acceleration switch with a robust latching mechanism and cylindrical contacts , 2010 .

[17]  R. Howe,et al.  Critical Review: Adhesion in surface micromechanical structures , 1997 .

[18]  Herbert Shea,et al.  Radiation sensitivity of microelectromechanical system devices , 2009 .

[19]  Stuart B. Brown,et al.  Subcritical crack growth in silicon MEMS , 1999 .

[20]  Yves-Alain Peter,et al.  Deformable MEMS grating for wide tunability and high operating speed , 2006 .

[21]  Robert Puers,et al.  Creep-resistant aluminum alloys for use in MEMS , 2005 .

[22]  Herbert Shea,et al.  MEMS Reliability , 2010 .

[23]  Jeremy A. Walraven,et al.  MEMS reliability in a vibration environment , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[24]  Jeremy A. Walraven,et al.  MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes , 2000 .