New assembly and interconnects beyond sintering methods

Today, with IGBT power modules a point has been reached where the operation area and life-time is limited by the standard packaging technologies, such as wire bonding and soft soldering. As a result, a further optimisation of the used technologies will not be sufficient to meet the future requirements of automotive industry and high reliability applications, such as wind energy or commercial vehicles. To surpass these limits an integrated technology package has been developed, that improves all life-time limiting areas (chip front side, chip back side, DCB-baseplate interconnect) within the IGBT module. In this paper power cycling results for this new technology package are presented. They clearly outperform today’s limits by more than a factor of ten.