Single-event effects in 0.18 /spl mu/m CMOS commercial processes
暂无分享,去创建一个
Sumio Matsuda | H. Asai | Yoshiya Iide | A. Makihara | H. Shindou | S. Kuboyama | Y. Sakaide | Y. Tsuchiya | T. Arimitsu
[1] M. Baze,et al. A digital CMOS design technique for SEU hardening , 2000 .
[2] S. Matsuda,et al. A nondamaging beam blanking SEM test method and its application to highly integrated devices , 2001 .
[3] R. Koga,et al. Application of hardness-by-design methodology to radiation-tolerant ASIC technologies , 2000 .
[4] Federico Faccio,et al. Single event effects in static and dynamic registers in a 0.25 /spl mu/m CMOS technology , 1999 .
[5] Allan H. Johnston,et al. The influence of VLSI technology evolution on radiation-induced latchup in space systems , 1996 .
[6] S. Whitaker,et al. Low power SEU immune CMOS memory circuits , 1992 .
[7] T. Calin,et al. Upset hardened memory design for submicron CMOS technology , 1996 .
[8] J. M. Benedetto. Single event effects and prompt dose hardness of a deep submicron commercial process , 2002, IEEE Radiation Effects Data Workshop.
[9] Steven H. Voldman,et al. Latchup in CMOS technology , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[10] D. S. Walsh,et al. SEU-sensitive volumes in bulk and SOI SRAMs from first-principles calculations and experiments , 2001 .
[11] Marty R. Shaneyfelt,et al. Impact of substrate thickness on single-event effects in integrated circuits , 2001 .