New Trends for Microwave Packaging into Space-Borne Equipment

This paper focuses on the most promising evolutions which are emerging in the packaging of microwave functions for space applications. Starting from the former micropackage solution, continuing with the current MCM technology, new routes are then reviewed. Those include flip-chip which has the huge advantage of short and reproducible connections, glob-top and other non-hermetic approaches. All of them are major departures from the present situation if not a complete revolution. Finally, a special attention is given to MEMS as these new devices can also bring their own intrinsic packaging solution. This is one of the most intriguing and captivating outcome of their apparition : at last, the convergence of electrical and mechanical expertise.