Systematic Lumped-Element Modeling of Differential IC Transmission Lines

In this paper, we report a systematic and efficient approach to obtain lumped-element models for differential integrated-circuit interconnect transmission lines covering both the low-frequency R/C as well as the high-frequency quasi-TEM behavior. To accurately model signal delay and loss, and to preserve causality, the frequency dependence of both line resistance as well as the line inductance is included in our model. The impact of ground inductance is also properly covered by the model. The validity of our approach is verified against experimental data collected up to 120 GHz for the even and odd modes on these differential transmission lines. We predict that these lines can transport data over 1-cm distance with rates up to 40 Gb/s, even with some imbalance in differential drive.

[1]  J. Kong,et al.  A hybrid method for the calculation of the resistance and inductance of transmission lines with arbitrary cross sections , 1991 .

[2]  T. K. Sarkar,et al.  On the modeling of conductor and substrate losses in multiconductor, multidielectric transmission line systems , 1991 .

[3]  L.F. Tiemeijer,et al.  Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes , 2007, IEEE Transactions on Microwave Theory and Techniques.

[4]  L.F. Tiemeijer,et al.  On the Accuracy of the Parameters Extracted From $S$-Parameter Measurements Taken on Differential IC Transmission Lines , 2009, IEEE Transactions on Microwave Theory and Techniques.

[5]  Kai Kang,et al.  A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 110 GHz , 2008, IEEE Transactions on Microwave Theory and Techniques.

[6]  Cheng-Kok Koh,et al.  Exact closed-form formula for partial mutual inductances of rectangular conductors , 2003 .

[7]  V. Tripathi.  Asymmetric Coupled Transmission Lines in an Inhomogeneous Medium , 1975 .

[8]  K. Okada,et al.  Transmission line interconnect on Si CMOS LSI , 2006, 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.

[9]  G.A.M. Hurkx,et al.  QUBiC4plus: a cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RF-system-in-package environment , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..

[10]  D. Ritter,et al.  A 25 GHz 3.3 dB NF low noise amplifier based upon slow wave transmission lines and the 0.18 μm CMOS technology , 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.

[11]  P. Ufimtsev,et al.  New results for the properties of TE surface waves in absorbing layers , 2001 .

[12]  Massoud Pedram,et al.  Ground bounce in digital VLSI circuits , 2003, IEEE Trans. Very Large Scale Integr. Syst..

[13]  D. P. Neikirk,et al.  Compact equivalent circuit model for the skin effect , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[14]  R. A. Pucel,et al.  Frequency Dependent Behavior of Microstrip , 1968 .

[15]  W. R. Eisenstadt,et al.  S-parameter-based IC interconnect transmission line characterization , 1992 .

[16]  H. Hasegawa,et al.  Properties of Microstrip Line on Si-SiO/sub 2/ System , 1971 .

[17]  W. Heinrich,et al.  Comments on "Internal impedance of conductors of rectangular cross section" , 2001 .

[18]  K. D. Marx,et al.  Propagation Modes, Equivalent Circuits, and Characteristic Terminations for Multiconductor Transmission Lines with Inhomogeneous Dielectrics , 1973 .

[19]  M. Islam,et al.  Quasi-static conductor loss calculations in transmission lines using a new conformal mapping technique , 1994 .

[20]  F.B.J. Leferink,et al.  Inductance of printed circuit board ground planes , 1993, 1993 International Symposium on Electromagnetic Compatibility.

[21]  E. Kurzweil,et al.  Catch the ground bounce before it hits your system , 1993, Proceedings of IEEE International Test Conference - (ITC).

[22]  Roger B. Marks,et al.  A Complete Multimode Equivalent-Circuit Theory for Electrical Design , 1997, Journal of research of the National Institute of Standards and Technology.

[23]  S. Ramo,et al.  Fields and Waves in Communication Electronics , 1966 .

[24]  Frank Leferink,et al.  Inductance calculations; methods and equations , 1995, Proceedings of International Symposium on Electromagnetic Compatibility.

[25]  G. Dambrine,et al.  Fabrication and characterization of low-loss TFMS on silicon substrate up to 220 GHz , 2005, IEEE Transactions on Microwave Theory and Techniques.

[26]  W. Heinrich,et al.  Full-wave analysis of conductor losses on MMIC transmission lines , 1989 .