Essentials for Finite Element Simulation

Finite Element (FE) simulation solves the mathematical model of the physical problem. The following sections discuss the essential elements for the FE simulation process with respect to an illustrative problem in the assessment of solder joint reliability. The problem considers a surface mount microelectronic test assembly with a flip-chip package mounted on a Printed Circuit Board (PCB) using an array of solder joints.

[1]  Santosh Shetty,et al.  Three- and Four-Point Bend Testing for Electronic Packages , 2003 .

[2]  Masazumi Amagai Chip Scale Package (CSP) solder joint reliability and modeling , 1999 .

[3]  Bongtae Han,et al.  High sensitivity moiré , 1994 .

[4]  Reza Ghaffarian Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA , 2003, Microelectron. Reliab..

[5]  H. Solomon Fatigue of 60/40 Solder , 1986 .

[6]  V. Sarihan,et al.  Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling , 1993 .

[7]  Wei Zhou,et al.  Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model , 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

[8]  B. Han,et al.  Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition , 2004 .

[9]  Taekoo Lee,et al.  Finite element analysis for solder ball failures in chip scale package , 1998 .

[10]  K. Ohguchi,et al.  Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling , 2001 .

[11]  D. M. Tracey,et al.  On the ductile enlargement of voids in triaxial stress fields , 1969 .

[12]  J. Reddy An introduction to the finite element method , 1989 .

[13]  S. Manson,et al.  Thermal Stress and Low-Cycle Fatigue , 2020, Encyclopedia of Continuum Mechanics.

[14]  J.-P.M. Clech,et al.  Surface mount assembly failure statistics and failure free time , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[15]  H. Reichl,et al.  An efficient approach to predict solder fatigue life and its application to SM- and area array components , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[16]  K. Huebner The finite element method for engineers , 1975 .

[17]  L. Anand Constitutive equations for hot-working of metals , 1985 .