Comparison of Neutron, Proton and Gamma Ray Effects in Semiconductor Devices

Interest in proton radiation effects has intensified in recent years. A prime focus is the relationship between proton displacement and ionization effects and the separate consideration of neutron-induced displacement and gamma-ionization effects in TREE characterization. Recent definitive work on proton and neutron displacement damage in silicon in terms of nonionizing energy loss has laid the groundwork for comparison of proton effects with the TREE data base. We initiate this comparison with a summary of device radiation susceptibilities in neutron and gamma environments. Proton interactions in silicon devices are then presented in terms of dose deposition and nonionizing energy loss. This leads to a neutron-proton damage equivalence factor and enables the development of simple correspondence. The device susceptibility charts are then combined so both displacement damage and ionization-damage can be schematically examined relative to proton dose. These susceptibility charts demonstrate the dominance of ionization effects for damage in a proton environment for modern silicon microcircuit technologies. This approach is presented as a convenient means of interpreting effects for both proton exposures and TREE simulators. It is concluded that TREE characterization can be used as a good first-order estimate of proton damage effects.

[1]  J. Barengoltz,et al.  Correlation of Displacement Effects Produced by Electrons Protons and Neutrons in Silicon , 1975, IEEE Transactions on Nuclear Science.

[2]  Larry M. Choate,et al.  New Neutron Simulation Capabilities Provided by the Sandia Pulse Reactor-III (SPR-III) and the Upgraded Annular Core Pulse Reactor (ACPR) , 1978, IEEE Transactions on Nuclear Science.

[3]  Total-Dose and Dose-Rate Dependence of Proton Damage in MOS Devices during and after Irradiation , 1984, IEEE Transactions on Nuclear Science.

[4]  T. R. Oldham,et al.  Proton and Heavy-Ion Radiation Damage Studies in MOS Transistors , 1985, IEEE Transactions on Nuclear Science.

[5]  E. A. Wolicki,et al.  Energy Dependence of Proton Displacement Damage Factors for Bipolar Transistors , 1986, IEEE Transactions on Nuclear Science.

[7]  E. Stassinopoulos,et al.  The Damage Equivalence of Electrons, Protons, and Gamma Rays in MOS Devices , 1982, IEEE Transactions on Nuclear Science.

[8]  R. J. Sokel,et al.  Neutron Irradiation for Prevention of Latch-Up in MOS Integrated Circuits , 1979, IEEE Transactions on Nuclear Science.

[9]  E. W. Enlow,et al.  Comparison of Proton and Neutron Carrier Removal Rates , 1987, IEEE Transactions on Nuclear Science.

[10]  R. Pease,et al.  Total Dose Effects in Recessed Oxide Digital Bipolar Microcircuits , 1983, IEEE Transactions on Nuclear Science.

[11]  E. Stassinopoulos,et al.  Recovery of Damage in Rad-Hard MOS Devices during and after Irradiation by Electrons, Protons, Alphas, and Gamma Rays , 1983, IEEE Transactions on Nuclear Science.

[12]  David K. Myers Radiation Effects on Commercial 4-Kilobit NMOS Memories , 1976, IEEE Transactions on Nuclear Science.

[13]  A. Ochoa,et al.  Latch-Up Elimination in Bulk CMOS LSI Circuits , 1980, IEEE Transactions on Nuclear Science.

[14]  P. W. Marshall,et al.  Correlation of Particle-Induced Displacement Damage in Silicon , 1987, IEEE Transactions on Nuclear Science.

[15]  Edward A. Burke,et al.  Energy Dependence of Proton-Induced Displacement Damage in Silicon , 1986, IEEE Transactions on Nuclear Science.

[16]  T. R. Oldham Analysis of Damage in MOS Devices for Several Radiation Environments , 1984, IEEE Transactions on Nuclear Science.