고발열 전자장치의 액체냉각 방식에 관한 실험연구

Experiments have been performed to investigate the cooling characteristics of the indirect liquid cooling method using water. The parameters were 9.8, 19.9 and 30.4 W/㎠ for heat flux of the simulated VLSI chips and Reynolds numbers ranging from approximately 5,000 to 16,000. The test section was consisted with in-line, four-row array of 12 heat sources for simulating 4×3 multichip module which were flush mounted on the top wall of a horizontal, rectangular channel of aspect ratio 0.2. The inlet temperature was 18.4 ℃ for all experiments, and the heater surface temperature did not exceed 80 ℃. The heat transfer coefficient can be considered to have reached a row-number-independent, fully developed value by the third row for all test runs. The average Nusselt numbers for the rows of the array decreased by approximately 15 % from the first to the fourth row, and the data for the first row were in good agreement within 8 % with results obtained by Incropera et al.