Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution
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[1] Michael R. Feldman. Holographic optical interconnects for multichip modules , 1991 .
[2] Constantine Alois Neugebauer,et al. Multichip Module Designs for High Performance Applications , 1990 .
[3] W. Hubbard,et al. Alignment and fabrication tolerances of planar gratings for board-to-board optical interconnects. , 1992, Applied optics.
[4] Ray T. Chen,et al. 1‐to‐12 surface normal three‐dimensional optical interconnects , 1993 .
[5] Tomasz P. Jannson,et al. 60 GHz board-to-board optical interconnection using polymer optical buses in conjunction with microprism couplers , 1992 .
[6] Donald P. Seraphim,et al. Interconnect and packaging technology in the '90s , 1991 .
[7] Mark A. Peskin,et al. Packing density and interconnection length of a highly parallel optical interconnect using polymer-based, single-mode bus arrays , 1994 .
[8] Ray T. Chen,et al. 45‐cm long compression‐molded polymer‐based optical bus , 1993 .
[9] F.J. Leonberger,et al. Optical interconnections for VLSI systems , 1984, Proceedings of the IEEE.
[10] Tomasz P. Jannson,et al. Guided-wave planar optical interconnects using highly multiplexed polymer waveguide holograms , 1992 .
[11] Ashok V. Krishnamoorthy,et al. Performance comparison between optoelectronic and VLSI multistage interconnection networks , 1991 .
[12] J W Goodman,et al. Design considerations for holographic optical interconnects. , 1987, Applied optics.