论文信息 - 3D electro-optical integration based on high-performance Si photonics TSV interposer

3D electro-optical integration based on high-performance Si photonics TSV interposer

3D electro-optical integration based on a Cu-based Si-photonics TSV interposer has been demonstrated for integrated optical communication applications. The photonics TSV interposer consisting of monolithically integrated TSV, modulators and photodetectors, enabling a 30 Gbps-data-rate.

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