DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment

The accurate prediction of operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack of reliable, standardised input data. This paper describes a recently-started 3-year European collaborative project, named DELPHI, whose goal is to solve this problem. Some preliminary results are reported on the development of compact thermal models for mono-chip packages. It is the authors’ contention that a future redefinition of the standards is to be expected, is necessary and should include protocols for thermal models in addition to ones for measurements.

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