A 30 ns 16Kx1 fully static RAM

A fully static 16K/spl times/1 random access memory (SRAM) with significantly improved speed is discussed. Design innovations using conservative 2.5 /spl mu/m transistors and state-of-the-art double level poly (DLP) scaled NMOS technology were utilized to accomplish 30 ns address and chip select access times with an active power of 550 mW and standby power of 75 mW. A cost effective DLP process was developed using `shared' contacts in the cell. These `shared' contacts utilize second level poly to provide connection between the first poly level and moat, reduced the number of contacts per cell to four. The DPL cell size is 1.6 mil/SUP 2/ (1000 /spl mu/m/SUP 2/) which yields a bar size of 158/spl times/264 mil/SUP 2/ (4.0/spl times/6.7 mm/SUP 2/). In this fully static design a novel architecture was used to power down half of the X-decoders in the active mode using the AO address buffer signals. This technique allowed the use of power saved in the X-decoder to be distributed throughout the circuit to improve overall access times. One of the other major speed improvements came from utilizing column sense amps. The use of the column sense amp improves the overall speed by more than 20 percent. A write cycle of 30 ns has been achieved with a typical write pulse width of 10 ns.

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[2]  A. Ebel,et al.  A 25ns 4K static RAM , 1979, 1979 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.