Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
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T. Magis | C. Laviron | A. Farcy | P. Chausse | N. Hotellier | P. Coudrain | G. Garnier | C. Aumont | A. Jouve | S. Cheramy | T. Mourier | N. Allouti | L. Gabette | C. Brunet-Manquat | E. Saugier | J.-P. Colonna | R. Segaud | K. Vial | P. Besson | J. Pruvost
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