The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements

The desire of flexibility, light weight and low cost in current electronic device has increased the application of flexible printed circuit board (FPCB). This paper aims to investigate the effect of different Reynolds number (Re) toward FPCB attached with ball grid array (BGA) package in different arrangements. Actual BGA package with 100 solder joints incorporating FPCB was attached to a fixture in wind tunnel test section to perform FPCB’s deflection analysis with different flow velocities and package’s configurations. Furthermore, numerical simulation was also performed to obtain numerical deflection and stress value. The findings show that the Reynolds numbers have a substantial effect to the FPCB’s deflection and stress. However, the BGA package’s positions on the FPCB were found to be insignificant to the responses. The actual BGA package on FPCB as presented in this paper will represent more realistic values of determined FPCB’s deflection and stress.

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