Power Integrity and Shielding Effectiveness Modeling of Grid Structured Interconnects on PCBs

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

[1]  Myron Crawford,et al.  Expanding the Bandwidth of TEM Cells for EMC Measurements , 1978, IEEE Transactions on Electromagnetic Compatibility.

[2]  Tom Dhaene,et al.  Selection of lumped element models for coupled lossy transmission lines , 1992, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[3]  Martin H. Graham,et al.  Book Review: High-Speed Digital Design: A Handbook of Black Magic by Howard W. Johnson and Martin Graham: (Prentice-Hall, 1993) , 1993, CARN.

[4]  A. Mohan,et al.  Plane-wave shielding effectiveness studies on conducting polypyrrole , 1994 .

[5]  Keunmyung Lee,et al.  Modeling and analysis of multichip module power supply planes , 1995 .

[6]  U. Yilmazer,et al.  Some microwave and mechanical properties of carbon fiber-polypropylene and carbon black-polypropylene composites , 1996 .

[7]  I. Novak,et al.  Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).

[8]  Barry Kent Gilbert,et al.  High-frequency characterization of power/ground-plane structures , 1999 .

[9]  Raymond E. Anderson,et al.  Power plane SPICE models for frequency and time domains , 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

[10]  Madhavan Swaminathan,et al.  Modeling of irregular shaped power distribution planes using transmission matrix method , 2001 .

[11]  Jong-Gwan Yook,et al.  Multilayer power delivery network design for high-speed microprocessor system , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[12]  B. Archambeault,et al.  Power integrity investigation of BGA footprints by means of the segmentation method , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..

[13]  R. Koga,et al.  Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes , 2005, IEEE Transactions on Electromagnetic Compatibility.

[14]  Joungho Kim,et al.  Modeling and measurement of simultaneous switching noise coupling through signal via transition , 2006, IEEE Transactions on Advanced Packaging.

[15]  Kaushik Roy,et al.  An Analytical Fringe Capacitance Model for Interconnects Using Conformal Mapping , 2006, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[16]  Tzong-Lin Wu,et al.  Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method , 2007, IEEE Transactions on Advanced Packaging.

[17]  Madhavan Swaminathan,et al.  Power Integrity Modeling and Design for Semiconductors and Systems , 2007 .

[18]  C. Paul.  Inductance: Loop and Partial , 2009 .

[19]  Joungho Kim,et al.  Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method , 2010, IEEE Transactions on Advanced Packaging.

[20]  Xing-Chang Wei,et al.  A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots , 2010, IEEE Transactions on Electromagnetic Compatibility.

[21]  W. Marsden.  I and J , 2012 .

[22]  Aaas News,et al.  Book Reviews , 1893, Buffalo Medical and Surgical Journal.