Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Abstract In this work, TiO 2 nanoparticles were successfully incorporated into Sn3.5Ag and Sn3.5Ag0.7Cu solder, to synthesize novel lead-free composite solders. Effects of the TiO 2 nanoparticle addition on the microstructure, melting property, microhardness, and the interfacial reactions between Sn3.5AgXCu and Cu have been investigated. Experimental results revealed that the addition of 0.5 wt.% TiO 2 nanoparticles in Sn3.5AgXCu composite solders resulted in a finely dispersed submicro Ag 3 Sn phase. This apparently provides classical dispersion strengthening and thereby enhances the shear strength of composite solder joints. After soldering, the interfacial overall intermetallic compounds (IMC) layer of the Sn3.5AgXCu lead-free solder joint was observed to have grown more significantly than that of the Sn3.5AgXCu composite solder joints, indicating that the Sn3.5AgXCu composite solder joints had a lower diffusion coefficient. This signified that the presence of TiO 2 nanoparticles was effective in retarding the growth of the overall IMC layer.

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