The Impact of Etch Depth of D-mode AlGaN/GaN MIS-HEMTs on DC and AC Characteristics of 10 V Input Direct-Coupled FET Logic (DCFL) Inverters

Large input swing of logic circuits (> 10 V) are essential for the full utilization of GaN integrated circuits (ICs) to match drivers or protection circuits of mainstream Si and SiC power MOSFETs. A 10 V input DCFL inverter was successfully achieved using monolithic integration of E/D-mode GaN MIS-HEMTs, which can operate at high temperatures up to 250 °C. The impact of the threshold voltage of D-mode devices using different etch depths of AlGaN barrier on the DC and AC performance of DCFL inverters is systematically studied at various temperatures from 25 °C to 250 °C. These results present a large input swing and a straightforward design of GaN-based logic circuits using E-mode AlGaN/GaN MIS-HEMTs without additional drivers or level shifters, and propose a validate method to provide strong immunity to high voltage overshoot.

[1]  Yuechan Kong,et al.  Monolithic Integration of E/D-Mode AlGaN/GaN MIS-HEMTs , 2014, IEEE Electron Device Letters.

[2]  Zhenchuan Yang,et al.  High-Temperature Operation of AlGaN/GaN HEMTs Direct-Coupled FET Logic (DCFL) Integrated Circuits , 2007, IEEE Electron Device Letters.

[3]  T. Ueda,et al.  A compact GaN-based DC-DC converter IC with high-speed gate drivers enabling high efficiencies , 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

[4]  Yong Cai,et al.  Temperature dependence and thermal stability of planar-integrated enhancement/depletion-mode AlGan/GaN HEMTs and digital circuits , 2009 .

[5]  Yilong Hao,et al.  High-Performance Normally-Off ${\rm Al}_{2}{\rm O}_{3}/{\rm GaN}$ MOSFET Using a Wet Etching-Based Gate Recess Technique , 2013, IEEE Electron Device Letters.

[6]  Xiaoping Li,et al.  High Temperature Characteristics of GaN-Based Inverter Integrated With Enhancement-Mode (E-Mode) MOSFET and Depletion-Mode (D-Mode) HEMT , 2014, IEEE Electron Device Letters.

[7]  Tom Tsai,et al.  Digital Integrated Circuits on an E-Mode GaN Power HEMT Platform , 2017, IEEE Electron Device Letters.

[8]  Alex Q. Huang,et al.  The 2018 GaN power electronics roadmap , 2018, Journal of Physics D: Applied Physics.

[9]  Shu Yang,et al.  Toward reliable MIS‐ and MOS‐gate structures for GaN lateral power devices , 2016 .

[10]  Y. Miyamoto,et al.  Normally-off AlGaN/GaN high-electron-mobility transistor using digital etching technique , 2015 .

[11]  Huiqing Wen,et al.  Monolithic integration design of GaN-based power chip including gate driver for high-temperature DC–DC converters , 2019, Japanese Journal of Applied Physics.