Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Controlled
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S. Kim | Jangjae Lee | Youngseok Lee | C. Cho | I. Seong | S. You | Youbin Seol | W. Jeong | Ye-bin You | M. Choi | Inho Seong | Shin-jae You
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