The effect of stress migration on electromigration in dual damascene copper interconnects
暂无分享,去创建一个
Chee Lip Gan | Nagarajan Raghavan | Kin Leong Pey | A. Heryanto | W. Liu | K. Pey | C. Gan | M. Lim | N. Raghavan | A. Heryanto | Y. K. Lim | Jun Wei | M. K. Lim | J. B. Tan | W. Liu | Jun Wei
[1] Christine S. Hau-Riege,et al. An introduction to Cu electromigration , 2004, Microelectron. Reliab..
[2] A. Grill,et al. Porosity in plasma enhanced chemical vapor deposited SiCOH dielectrics: A comparative study , 2003 .
[3] Conyers Herring,et al. Stress generation by electromigration , 1976 .
[4] Paul S. Ho,et al. Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures , 2003 .
[5] Ahila Krishnamoorthy,et al. Electromigration in copper damascene interconnects : reservoir effects and failure analysis , 2005 .
[7] M. Korhonen,et al. Stress evolution due to electromigration in confined metal lines , 1993 .
[8] Christine Hau-Riege,et al. The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects , 2004 .
[9] Martin Gall,et al. Large-scale statistical analysis of early failures in Cu electromigration, Part I: Dominating mechanisms , 2010 .
[10] Mingte Lin,et al. Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting , 2006 .
[11] Chee Lip Gan,et al. Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization , 2001 .
[12] Young-Chang Joo,et al. Effect of low- k dielectric on stress and stress-induced damage in Cu interconnects , 2004 .
[13] James R. Lloyd,et al. Electromigration in integrated circuit conductors , 1999 .
[14] Paul S. Ho,et al. Electromigration critical length effect in Cu/oxide dual-damascene interconnects , 2001 .
[15] Cher Ming Tan,et al. Unveiling the electromigration physics of ULSI interconnects through statistics , 2007 .
[16] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .