A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture

This paper describes the feasibility of accurate low frequency measurements in predicting the breakdown of modern lead free ball grid array (BGA) interconnections. In these measurements, performed partly with 1149.4 analogue boundary scan, ceramic BGA modules measuring 15x15mm in width, with 9x9 ball matrixes, were attached on an FR-4 printed wiring board (PWB) and thermally cycled over a temperature range of -40 to +125^oC. The condition of corner interconnections was monitored using the developed measurement methods and construction. In-situ measurements were performed with a datalogger during temperature cycling, accompanied with 1149.4 mixed-signal test bus measurements of corner interconnections performed between cycling intervals. In addition, the measurements were complemented by scanning acoustic microscopy and, X-ray. Monitoring corner interconnections by a simple, low-frequency voltage measurement method with embedded test constructions gives an early warning indication well before the electrical interconnection failures. Of two studied interconnection compositions, the ones with plastic core solder balls (PCSB) proved to be more reliable than the ones with 90/10 PbSn balls.

[1]  K. Kautio,et al.  Solder joint reliability in AgPt‐metallized LTCC modules , 2005 .

[3]  Jussi Putaala,et al.  Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies , 2006, Microelectron. Reliab..

[4]  Stephen K. Sunter,et al.  A general purpose 1149.4 IC with HF analog test capabilities , 2001, Proceedings International Test Conference 2001 (Cat. No.01CH37260).

[5]  Guo-Quan Lu,et al.  Effects of solder joint shape and height on thermal fatigue lifetime , 2003 .

[6]  Y. Nagai,et al.  Excellent reliability of solder ball made of a compliant plastic core , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[7]  J. E. Semmens,et al.  Characterization of flip chip interconnect failure modes using high frequency acoustic micro imaging with correlative analysis , 1997, 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual.

[8]  Frank Stepniak.  Failure criteria of flip chip joints during accelerated testing , 2002, Microelectron. Reliab..

[9]  Ahmer Syed,et al.  Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).