A Novel Layer Stack-Up With Free Cavity Resonance for High-Performance Power Noise Suppression

In this paper, a novel layer stack-up with free cavity resonance is proposed for high-performance power noise suppression. In this layer stack-up, power planes for power delivery are sandwiched by ground planes and are moved close to the component sides, so that they are separated from signal layers. Signal layers are isolated by ground planes, which provide ideal ground reference. Arrays of ground shorting vias are introduced to ac short ground reference plane pairs to remove their cavity resonances. This structure has free cavity resonance under the corner frequency of the periodic via array, and it has an excellent wideband noise suppression with starting point from dc. This stack-up not only has high-performance noise suppression, but also can significantly improve the signal integrity and reduce the electromagnetic interference of the board. Simulation and measurement are performed to verify the validity of the proposed layer stack-up.

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