Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

[1]  Michael Havbro Faber,et al.  Indicators for Inspection and Maintenance Planning of Concrete Structures , 2002 .

[2]  Hua Lu,et al.  Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect , 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

[3]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[4]  E. E. Kostandyan,et al.  Reliability of Wind Turbine components — Solder elements fatigue failure , 2012, 2012 Proceedings Annual Reliability and Maintainability Symposium.

[5]  Adam Niesłony,et al.  Determination of fragments of multiaxial service loading strongly influencing the fatigue of machine components , 2009 .

[6]  Cristian Busca.  Modeling lifetime of high power IGBTs in wind power applications - An overview , 2011, 2011 IEEE International Symposium on Industrial Electronics.

[7]  John Dalsgaard Sørensen,et al.  Probabilistic Design of Wind Turbines , 2010 .

[8]  Chris Bailey,et al.  Design for reliability of power electronics modules , 2009, Microelectron. Reliab..

[9]  Lawrence L. Kupper,et al.  Probability, statistics, and decision for civil engineers , 1970 .

[10]  M.T. Iqbal,et al.  Power Electronics Reliability Comparison of Grid Connected Small Wind Energy Conversion Systems , 2011 .

[11]  Jianmin Qu,et al.  Creep and Fatigue Behavior of SnAg Solders With Lanthanum Doping , 2008, IEEE Transactions on Components and Packaging Technologies.

[12]  V. Barnett,et al.  Applied Linear Statistical Models , 1975 .

[13]  R. Schacht,et al.  Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[14]  Niels C. Lind,et al.  Methods of structural safety , 2006 .

[15]  John Dalsgaard Sørensen,et al.  Reliability-Based Design of Wind Turbine Blades , 2011 .

[16]  John Dalsgaard Sørensen,et al.  Framework for Risk-based Planning of Operation and Maintenance for Offshore Wind Turbines , 2009 .

[17]  C. Bailey,et al.  A Physics-of-failure based Prognostic Method for Power Modules , 2008, 2008 10th Electronics Packaging Technology Conference.

[18]  H. Raiffa,et al.  Applied Statistical Decision Theory. , 1961 .

[19]  Peter Tavner,et al.  Wind turbine downtime and its importance for offshore deployment. , 2011 .