An innovative approach to cutting force modelling in diamond turning and its correlation analysis with tool wear

In this article, a novel cutting force modelling approach is proposed by employing the specific cutting force and corresponding quantitative analysis on the dynamic cutting process in diamond turning so as to accurately represent the dynamic cutting behaviour including both amplitude and spatial aspects simultaneously. The specific cutting forces at the unit cutting length and area as the so-called amplitude aspect can provide insight into the micro cutting phenomena particularly in relation to the chip formation and size effects. The cutting forces are analysed against the dynamically varied cutting time interval, as the so-called spatial aspect using wavelet transform technique and standard deviation analysis can render their dynamic components to particularly represent dynamic effects of the cutting process and their correlation with tool wear. The cutting trials on titanium, silicon, and aluminium are carried out at a diamond turning test rig and supported with finite element analysis–based simulations, to further investigate the cutting force modelling and its correlation with the dynamic cutting process with a focus on the pressure distribution on the tool cutting edge, chip formation, and corresponding tool wear.

[1]  Bhushan Sopori,et al.  Strength of silicon wafers: fracture mechanics approach , 2009 .

[2]  Chi Fai Cheung,et al.  A Microplasticity Analysis of Micro-Cutting Force Variation in Ultra-Precision Diamond Turning , 2002 .

[3]  Tuğrul Özel,et al.  Multi-objective process optimization for micro-end milling of Ti-6Al-4V titanium alloy , 2012 .

[4]  T. Özel,et al.  Investigations on the effects of friction modeling in finite element simulation of machining , 2010 .

[5]  Jeong-Du Kim,et al.  Theoretical analysis of micro-cutting characteristics in ultra-precision machining , 1995 .

[6]  Thomas A. Dow,et al.  Tool force model development for diamond turning , 1990 .

[7]  Kai Cheng,et al.  Cutting force–based analysis and correlative observations on the tool wear in diamond turning of single-crystal silicon , 2015 .

[8]  A.C.H. van der Wolf,et al.  Cutting forces and their influences upon the surface integrity in single-point diamond turning , 1988 .

[9]  P. Srinivasa Pai,et al.  Tool-Edge Wear and Wavelet Packet Transform Analysis in High-Speed Machining of Inconel 718 , 2012 .

[10]  M. C. Shaw The size effect in metal cutting , 1952, Journal of Fluids Engineering.

[11]  Simon S. Park,et al.  Investigation of micro-cutting operations , 2006 .

[12]  François Ducobu,et al.  Chip Formation and Minimum Chip Thickness in Micro-milling , 2009 .

[13]  Fengzhou Fang,et al.  Modelling and experimental investigation on nanometric cutting of monocrystalline silicon , 2005 .

[14]  A White,et al.  A Review of Some Current Research in Microelectromechanical Systems (MEMS) with Defence Applications , 2002 .

[15]  M. F. DeVries,et al.  Neural Network Sensor Fusion for Tool Condition Monitoring , 1990 .

[16]  R. Krishnamurthy,et al.  Modelling of tool wear based on cutting forces in turning , 1993 .

[17]  Sangkee Min,et al.  Recent Advances in Mechanical Micromachining , 2006 .

[18]  Kai Cheng,et al.  Micro-Cutting: Fundamentals and Applications , 2013 .

[19]  Tao Wu,et al.  An investigation on the cutting performance of nano-crystalline diamond coatings on a micro-end mill , 2012 .

[20]  Muhammad Ekhlasur Rahman,et al.  Experimental study of micro- and nano-scale cutting of aluminum 7075-T6 , 2006 .

[21]  Jae-Seob Kwak,et al.  Application of wavelet transform technique to detect tool failure in turning operations , 2006 .

[22]  Jianfeng Li,et al.  Vibration analysis in milling titanium alloy based on signal processing of cutting force , 2013 .

[23]  J. Patten,et al.  Ductile Regime Nanomachining of Single-Crystal Silicon Carbide , 2005 .

[24]  Wei Zhou,et al.  A study on mechanism of nano-cutting single crystal silicon , 2007 .

[25]  T. Moriwaki,et al.  Machinability of Copper in Ultra-Precision Micro Diamond Cutting , 1989 .

[26]  Tae Jo Ko,et al.  Micro-end-milling of single-crystal silicon , 2007 .

[27]  Kai Liu,et al.  Process Modeling of Micro-Cutting Including Strain Gradient Effects , 2005 .

[28]  John S. Strenkowski,et al.  Finite element models of orthogonal cutting with application to single point diamond turning , 1988 .

[29]  Toshimichi Moriwaki,et al.  Ultraprecision Metal Cutting — The Past, the Present and the Future , 1991 .

[30]  S. Melkote,et al.  Effect of plastic side flow on surface roughness in micro-turning process , 2006 .

[31]  P. S. Heyns,et al.  WEAR MONITORING IN TURNING OPERATIONS USING VIBRATION AND STRAIN MEASUREMENTS , 2001 .

[32]  S. I. Jaffery,et al.  Wear mechanisms analysis for turning Ti-6Al-4V—towards the development of suitable tool coatings , 2012 .