Simulated Annealing Algorithm in the Application of Thermal Reliability

According to the influence of temperature on the lifespan of electronic devices, this paper uses the simulated annealing algorithm to optimize the layout of array distributed electronic components, and the finite element method to verify the result. The results show that it can effectively lower the high temperature of the electronic components through the layout optimization. The highest temperature and the average temperature are decreased by 10.49% and 10.41% respectively in this simulation, which indicates the simulated annealing algorithm can effectively solve the problem of layout optimization of components on the printed circuit board and avoid large-scale computing in the traditional algorithm. This algorithm is of practical value in the field of engineering.