Half-bridge drive circuit's isolation encapsulation framework

The utility model relates to a half-bridge drive circuit's isolation encapsulation framework, including half-bridge drive circuit body, cut apart into two modules with it, first module is work at logical processing circuit, pulse-generating circuit, superhigh pressure NMOS transistor and the low limit drive circuit in VCC-GND power territory, the second module is work at RS trigger, load resistance and the gao bian drive circuit in VB-VS power territory, first module adopts UHV process integration to be first integrated package to draw forth two first pads on first integrated package, the second module adopts 30VHV process integration to be the second integrated package to draw forth two second pads on the second integrated package, first integrated package and second integrated package set up on the relevant position on lead frame surface side by side to encapsulate this lead frame in same plastic-sealed body through two chip package techniques, link to each other through the wire between first pad and the second pad to form an integrated circuit who has complete half-bridge drive function.