Design Tools for3DMixedModePlacement

We present asetofdesign tools forthreedimen- sional (3D)mixedmodeplacement (MMP).Thehierarchical 3D MMP design tooliscomposed ofahierarchical clustering pack- age,anew3Dfloorplanning tool, routeplanning tool, and2D global/detailed placement tools. We haveanalyzed theper- formance of3Dcircuit using these tools. Itisshownthattotal wirelength couldbereduced by25% to43% compared with traditional 2Ddesign using twotofourstacked dies. Byincor- porating thermal management andanalysis, wealsoinvestigate thethermal scalability of3Dintegration. ~~~ ~ ~~~~~~/ _-v