Wafer extracting method and wafer extracting device

The invention discloses a wafer extracting method and a wafer extracting device, wherein the wafer extracting method comprises the steps of determining a machine station for extracting the wafer; obtaining a correspondence between the wafer and the machine station; searching the wafer which corresponds with the machine station that extracts the wafer according to the correspondence between the wafer and the machine station; and extracting the wafer from the searched wafer. The wafer extracting method and the wafer extracting device settle a problem of incapability of accurately covering the machine station in extracting the wafer when the wafer is measured in prior art, and furthermore realizes an effect of accurately covering the machine station in extracting the wafer.