Automated approach to the analysis of geometric parameters of MEMS elements

Modern high-tech MEMS manufacturing is not able to function without developed system of quality monitoring. Wellmanaged quality monitoring system enables to predict production risks and minimize them effectively. We devoted our research to such quality measurement tool as monitoring of product’s geometrical parameters between different MEMS manufacturing stages. This paper presents an example of automated approach to the analysis of optical images with the aim to control critical dimensions (CD) of MEMS products. For the purpose of CD monitoring, the special software has been developed. It executes several algorithms, such as image segmentation and Deriche edge detection, which allow to process one or several of images in a resource-saving manner. These algorithms were tested on both the interprocess control of critical dimensions and the control of kerf width and chipping after dicing technological process. As the result of their applying, huge-sized images (2 GB) are being processed in time less than 2 minutes and full optical inspection takes less than 10 minutes per wafer.