论文信息 - OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS) - 字舞流文

OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

Satoru Yoneyama | Satoru Yoneyama | Shuichi Arikawa | Riku Yoshida | Yasuhisa Fujimoto | Yohei Omoto | Yasuhisa Fujimoto | Riku Yoshida