Transient Electrical-Thermal Analysis of 3-D Power Distribution Network With FETI-Enabled Parallel Computing

In this paper, the transient electrical-thermal co-simulation is implemented with the finite-element method. The capability of the co-simulation is extended to solve large-scale problems by incorporating a domain decomposition scheme called the finite element tearing and interconnecting (FETI). With the high parallel efficiency of FETI for computing with multiple processors, a significant reduction in computation time is achieved. The transient electrical-thermal behaviors of largescale power distribution networks (PDNs), including on-chip power grids, solder bump arrays, and TSV-based PDN are simulated and analyzed with the proposed method. The impacts on the design of the PDNs from different types of input pulses, power maps, and via pitches are also investigated.

[1]  Jian-Ming Jin,et al.  A Complete Finite-Element Analysis of Multilayer Anisotropic Transmission Lines From DC to Terahertz Frequencies , 2008, IEEE Transactions on Advanced Packaging.

[2]  D. R. Fokkema,et al.  BICGSTAB( L ) FOR LINEAR EQUATIONS INVOLVING UNSYMMETRIC MATRICES WITH COMPLEX , 1993 .

[3]  Jian-Ming Jin,et al.  Parallel implementation of the FETI-DPEM algorithm for general 3D EM simulations , 2009, J. Comput. Phys..

[4]  King-Ning Tu,et al.  Current-crowding-induced electromigration failure in flip chip solder joints , 2002 .

[5]  M. Glavanovics,et al.  Transient non-linear thermal FEM simulation of smart power switches and verification by measurements , 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

[6]  En-Xiao Liu,et al.  Multi-physics modeling of through-silicon vias with equivalent-circuit approach , 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

[7]  Shen Lin,et al.  Challenges in power-ground integrity , 2001, IEEE/ACM International Conference on Computer Aided Design. ICCAD 2001. IEEE/ACM Digest of Technical Papers (Cat. No.01CH37281).

[8]  Jian-Ming Jin,et al.  A Comparative Study of Three Finite Element-Based Explicit Numerical Schemes for Solving Maxwell's Equations , 2011, IEEE Transactions on Antennas and Propagation.

[9]  C. Farhat,et al.  A method of finite element tearing and interconnecting and its parallel solution algorithm , 1991 .

[10]  Sailing He,et al.  Multiphysics Characterization of Transient Electrothermomechanical Responses of Through-Silicon Vias Applied With a Periodic Voltage Pulse , 2010, IEEE Transactions on Electron Devices.

[11]  David A. B. Miller,et al.  Device Requirements for Optical Interconnects to Silicon Chips , 2009, Proceedings of the IEEE.

[12]  Jian-Ming Jin,et al.  Electrical-Thermal Co-Simulation for DC IR-Drop Analysis of Large-Scale Power Delivery , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[13]  Er-Ping Li,et al.  Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC , 2012 .

[14]  Uri C. Weiser,et al.  Interconnect-power dissipation in a microprocessor , 2004, SLIP '04.

[15]  Qing Huo Liu,et al.  Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse , 2010, IEEE Transactions on Electron Devices.

[16]  Jian-Ming Jin,et al.  A Vector Dual-Primal Finite Element Tearing and Interconnecting Method for Solving 3-D Large-Scale Electromagnetic Problems , 2006 .

[17]  Jian-Ming Jin,et al.  Thermal-Aware High-Frequency Characterization of Large-Scale Through-Silicon-Via Structures , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[18]  Kevin Skadron,et al.  Temperature-Aware Computer Systems: Opportunities and Challenges , 2003, IEEE Micro.

[19]  D. Rixen,et al.  A simple and efficient extension of a class of substructure based preconditioners to heterogeneous structural mechanics problems , 1999 .