Testing structure for analyzing reliability of integrated circuit and testing method thereof

The invention discloses a testing structure for analyzing the reliability of an integrated circuit. The testing structure comprises a first-layer structure body, a second-layer structure body and a through hole structure body. The first-layer structure body comprises a first voltage testing end and a second current testing end. The second-layer structure body comprises a second voltage testing end, a second current testing end, a resistor structure body and a third voltage testing end. The first voltage testing end and the first current testing end are connected with one end of the through hole structure body. One end of the second voltage testing end and one end of the resistor structure body are connected with the other end of the through hole structure body. The other end of the resistor structure body is connected with the other end of the through hole structure body and is connected with the third voltage testing end and the second current testing end. The invention further discloses a testing method of the testing structure. By the adoption of the testing structure for analyzing the reliability of the integrated circuit, the influence of errors of a testing machine system can be avoided, the influence of stress migration on devices is accurately evaluated, and therefore the accuracy of reliable analysis is guaranteed.