Low temperature InP layer transfer onto Si by helium implantation and direct wafer bonding
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Silke Christiansen | R. Scholz | I. Radu | I. Radu | R. Scholz | S. Christiansen | C. Himcinschi | Ulrich Gösele | Cameliu Himcinschi | R. Singh | U. Gösele | R. Singh
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