Continuous-wave operation of photonic band-edge laser at 1.55 μm on silicon wafer

We present continuous-wave laser operation at room temperature at 1.55 μm by optically pumping a photonic crystal structure containing an InGaAs/InP quantum well active layer. The active layer is integrated onto a Silicon chip by means of Au/In bonding technology. This metallic layer provides the reduction of heating by thermal dissipation into the substrate, and increases the quality-factor by reducing the radiative losses.

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