Solder self-alignment for optical MEMS

This paper discusses the use of solder self-alignment to assemble novel three-dimensional MEMS and package MEMS with other optical devices with precision alignment. Soldering is a predominant technology for electronics assembly, and is being developed for optoelectronic passive alignment. Using solder, hundreds or thousands of precision alignments can be accomplished with a single batch reflow process, and the cost/alignment can be reduced by orders of magnitude.