Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems

Hot embossing allows directly integrating conduction paths made of gold in the channel structures required for applications in lab-on-chip systems. In experiments, ditch depths of more than 100 micrometers wide and 2-3 micrometers thick construction paths. It turned out to be of no relevance whether the inclination of the lateral walls was 45 degree(s) or 90 degree(s).