论文信息 - Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach

Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results

Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.

Artur Wymyslowski | Ole Holck | Sebastian J. Tesarski

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