Direct To Digital Holography For High Aspect Ratio Inspection of Semiconductor Wafers

Direct to Digital Holography (DDH) has been developed as a semiconductor wafer inspection tool and in particular as a tool for seeing defects in high aspect ratio (HAR) structures on semiconductor wafers and also for seeing partial‐height defects. While the tool works very well for general wafer inspection, it has unusual capabilities for high aspect ratio inspection (HARI) and for detecting thin residual film defects (partial height defects). Inspection of HAR structures is rated as one of the highest unmet priorities of the member companies of International SEMATECH, and finding residual thin film defects (in some cases called “stringers”) is also a very difficult challenge. The capabilities that make DDH unusually sensitive include: 1) the capture of the whole wave—both the classical amplitude captured by traditional optical systems, and the phase of the wave, with phase potentially measured to ∼1/1000’th of a wavelength or ∼2 to 3 Angstroms for a deep ultra‐violet (DUV) laser; 2) heterodyne detection—...