Recovery for SiCw/6061 aluminium alloy composite chips by hot compression

Abstract The recovery process of 20 vol.-%SiCw/6061 aluminium alloy composite chips has been investigated. The results have shown that, by selecting the proper hot compression parameters, the tensile strengths of recovered composites can reach 85% of the original composite strength. The elastic modulus remained very close to that of the original composite and the binding among the chips was good. Therefore, the recovered composite had a good re-utilisation value.