Direct-Write Dewetting of High Melting Temperature Metals on Flexible Substrates

Microelectromechanical systems (MEMS) are pervasive in modern technology due to their reliability, small foot print, and versatility of function. While many of the manufacturing techniques for MEMS devices stem from integrated circuit (IC) manufacturing, the wide range of designs necessitates more varied processing techniques. Here, new details of a scanning laser based direct-write dewetting technique are presented as an expansion of previous demonstrations. For the first time, the ability to pattern a high melting temperature and high reflectance metallic thin films of Ni and Ag, respectively, on polymer substrates is reported. Novel methods for reducing the power necessary for processing highly reflective films are demonstrated by depositing very thin films of high near-infrared absorbance.

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