论文信息 - Recycling SiC Focus Rings for Reactive Ion Etching Equipment by Insertless Diffusion Bonding using Hot Isostatic Pressing - 字舞流文

Recycling SiC Focus Rings for Reactive Ion Etching Equipment by Insertless Diffusion Bonding using Hot Isostatic Pressing

J. Kataoka | T. Homma | R. Saito | Tetsuyuki Matsumoto

[1] Yang Kyung Chae,et al. Effect of Structure and Material Variation of Focus Ring for Enhanced Etch Resistance , 2017 .

[2] Sung-Min Lee,et al. Plasma Resistance and Etch Mechanism of High Purity SiC under Fluorocarbon Plasma , 2012 .

[3] Hidehiko Tanaka. Silicon carbide powder and sintered materials , 2011 .

[4] 夕起石田. 化学気相法による SiC 高速エピタキシャル成長技術の現状 , 2011 .

[5] M. Kushner,et al. Penetration of plasma into the wafer-focus ring gap in capacitively coupled plasmas , 2007 .

[6] J. Schuster,et al. Layer Structure and Fracture Strength of SiC/Cr Joint , 1997 .

[7] J. Schuster,et al. Reaction Mechanism between SiC Ceramic and Ti Foil in Solid State Bonding , 1995 .

[8] H. Takashio. Special issue engineering materials and their applications ( bonding technique of fine ceramics and its application ). , 1990 .

[9] T. Hirai,et al. Apparatus for chemical vapor deposition of silicon carbide. , 1987 .

[10] O. Ohashi. Effect of welding atmosphere on residual gas in void at diffusion-welded joint. , 1986 .