Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temperature Applications

This paper summarizes the results of qualification testing of the Electroless Nickel / Electroless Palladium / Immersion Gold (Ni/Pd/Au) process as it may be applied for use in high-temperature functional applications. The effects of exposure to heated, high humidity environments were also examined, in addition to the impact of extended thermal cycling.