Promoting fountain behaviors with cone surface structures under impinging jets

[1]  Qinghua Deng,et al.  Heat Transfer Enhancement of Impingement Cooling by Different Crossflow Diverters , 2021, Journal of Heat Transfer.

[2]  A. Emadi,et al.  Numerical Investigation of Liquid Jet Impingement for Power Electronics Cooling in Electrified Transportation , 2021, 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

[3]  B. Vandevelde,et al.  Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC) , 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[4]  Sreekant Narumanchi,et al.  Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions , 2021, Journal of Electronic Packaging.

[5]  R. Knight,et al.  A Numerical and Experimental Study of Staggered Submerged Liquid Jet Arrays Using Variable Angle Discharge Manifolds , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Darshan G. Pahinkar,et al.  Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[7]  R. Tummala,et al.  Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes , 2018 .

[8]  Y. Rao.  Jet Impingement Heat Transfer in Narrow Channels with Different Pin Fin Configurations on Target Surfaces , 2018 .

[9]  Gregory J. Michna,et al.  Reducing Crossflow Effects in Arrays of Impinging Jets , 2017 .

[10]  Seow Meng Low,et al.  Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[11]  Phillip M. Ligrani,et al.  Impingement jet array heat transfer with small-scale cylinder target surface roughness arrays , 2017 .

[12]  R. Kneer,et al.  Flow structures and heat transfer characteristics in arrays of submerged laminar impinging jets , 2016 .

[13]  Subramanian S. Iyer,et al.  Heterogeneous Integration for Performance and Scaling , 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[14]  R. Knight,et al.  Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements , 2015 .

[15]  S. Narumanchi,et al.  Microstructured Surfaces for Single-Phase Jet Impingement Heat Transfer Enhancement , 2013 .

[16]  Wei Yu,et al.  Experimental study of heat transfer coefficient on hot steel plate during water jet impingement cooling , 2012 .

[17]  Srinath V. Ekkad,et al.  Jet impingement heat transfer on dimpled target surfaces , 2002 .

[18]  B. Sundén,et al.  Impingement cooling in a rib-roughened channel with cross-flow , 2001 .

[19]  P. Roache.  Perspective: A Method for Uniform Reporting of Grid Refinement Studies , 1994 .

[20]  B. W. Webb,et al.  Air jet impingement heat transfer from modified surfaces , 1993 .

[21]  Thomas A. Trabold,et al.  Impingement Heat Transfer Within Arrays of Circular Jets: Part 1—Effects of Minimum, Intermediate, and Complete Crossflow for Small and Large Spacings , 1987 .

[22]  T. Trabold,et al.  Impingement Heat Transfer Within Arrays of Circular Jets: Part II—Effects of Crossflow in the Presence of Roughness Elements , 1987 .

[23]  R. Rodriguez,et al.  Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions , 2022, IEEE Transactions on Transportation Electrification.

[24]  K. Paik,et al.  Challenges and recent prospectives of 3D heterogeneous integration , 2022, e-Prime - Advances in Electrical Engineering, Electronics and Energy.

[25]  Wolfgang Sanz,et al.  A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics , 2020, IEEE Access.