A methodology for the generation of dynamic compact models of packages and heat sinks from thermal transient measurements

In this paper we present a methodology that we have recently elaborated for the generation of transient compact models of packages and heat sinks entirely from measured thermal transient results. The main advantage of generating the models from measured results is the time-gain. We do not need to build up the detailed structural model of the package or the heat sink in order to simulate it, as suggested by the DELPHI methodology. An additional advantage is that the lengthy transient simulations are not needed. In the paper we first summarize the way of generating the compact models of packages and heat sinks from measurements. After this we present how to use the obtained dynamic compact package models in board level simulators, that are extended with the feature of calculating with compact models.

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