자동차용 정션블럭 PCB의 열 분포 해석에 관한 연구

This paper describes the thermal distribution analysis of junction block in vehicle using finite element method. Junction block of PCB type is composed of fuse, relay, electric device, etc. The heating of PCB components causes damage or malfunction. Therefore, The Measures are required to protect components from the heat. This paper includes the analysis of PCB component samples and the performance of the heat generation test and thermal distribution analysis. Also, The thermal analysis is performed using 3D modeling and we constructed material properties database. The result of PCB analysis indicates that average error is 1.8℃. In this study, we constructed the material property database of PCB components and developed verification technique through simulation.